SLW-332
- Field
- Semiconductor materials Semiconductor materials
- Characteristic performance
- Epoxy resin Low temperature curing Sheet resin High heat resistance High Tg Low warpage
- Application method
- Communication related WLP 5G Encapsulation MUF (Mold Underfill) PLP
Inquiries
Please feel free to contact us, such as consultation on the detailed information for products.
