EA-436-A13 Encapsulant for semiconductor package
- Field
- Semiconductor materials Liquid encapsulant Underfill material Semiconductor materials Liquid mold underfill material
- Characteristic performance
- High moisture resistance Low CTE One component Epoxy resin High heat resistance High Tg Low warpage High adhesion
- Application method
- MUF (Mold Underfill) 5G/ Communication related Encapsulant Module Sensor
|
Item |
EA-436-A13 |
| Viscosity | 200 Pa・s |
| Coefficient of thermal expansion (CTE) | 10 ppm/℃ |
| Tg | 200℃ |
Inquiries
Please feel free to contact us, such as consultation on the detailed information for products.
