EZ-420-6 Underfill
- Field
- Semiconductor materials Underfill material Semiconductor materials
- Characteristic performance
- High filling property Rapid curing Low CTE One component Epoxy resin Low stress Low viscosity
- Application method
- Chip components adhesive Adhesive/ Fixing Underfill Dispensing BGA / CSP Module Sensor
| Item | EZ-420-6 |
| Viscosity | 7 Pa・s |
| Coefficient of thermal expansion (CTE) | 34 ppm/℃ |
| Tg |
106℃ |
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