EZ-421-B5 Underfill
- Field
- Semiconductor materials Underfill material Semiconductor materials
- Characteristic performance
- High filling property Rapid curing One component Epoxy resin Low viscosity
- Application method
- Chip components adhesive Adhesive/ Fixing Underfill Dispensing BGA / CSP Module Sensor
| Item |
EZ-421-B5 |
| Viscosity |
0.8 Pa・s |
| Cure condition |
150℃ / 30 min |
| Tg |
144℃ |
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