EF-291 Underfill
- Field
- Semiconductor materials Underfill material Semiconductor materials
- Characteristic performance
- High filling property Rapid curing One component Epoxy resin Low viscosity
- Application method
- Chip components adhesive Adhesive/ Fixing Underfill Dispensing BGA / CSP Module Sensor
| Item |
EF-291 |
| Viscosity | 3 Pa・s |
| Cure condition |
120℃ / 10 min |
| Tg |
120℃ |
Inquiries
Please feel free to contact us, such as consultation on the detailed information for products.
