NPR-770H4S
- Field
- Semiconductor materials Liquid encapsulant Semiconductor materials Liquid mold underfill material
- Characteristic performance
- High dissipation One component Epoxy resin High heat resistance High thermal conductivity High Tg High adhesion
- Application method
- Battery/Cell peripheral parts Encapsulant Module Sensor
| Item | NPR-770H4S |
|
Viscosity |
250 Pa・s |
|
Thixotropic Index (TI) |
3.0 |
|
Thermal conductivity |
2.3 W/m*K |
Inquiries
Please feel free to contact us, such as consultation on the detailed information for products.
