EF-364S3 Encapsulant for semiconductor package
- Field
- Semiconductor materials Liquid encapsulant Underfill material Semiconductor materials Liquid mold underfill material
- Application method
- 5G/ Communication related Encapsulant Module Sensor
| Item | EF-364S3 |
| Viscosity | 240 Pa・s |
| Thixotropic Index (TI) | 0.9 |
| Coefficient of thermal expansion (CTE) | 15 ppm/℃ |
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