EF-413 Encapsulant
- Field
- Semiconductor materials Encapsulant for CIS related Liquid encapsulant Semiconductor materials Liquid mold underfill material
- Characteristic performance
- High moisture resistance Low CTE Epoxy resin High adhesion
- Application method
- Encapsulant for CMOS Image sensor Automodtive applications Sensor Dispense
| Item | EF-413 |
| Viscosity | 360 Pa・s |
| Thixotropic Index (TI) | 0.9 |
| Tg | 60℃ |
| Coefficient of thermal expansion (CTE) | 10 ppm/℃ |
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