SD-305-C23 Glass sealing material
- Field
- Semiconductor materials CIS related material Semiconductor materials
- Characteristic performance
- High Thixotroly Bleedless High moisture resistance One component Epoxy resin High heat resistance High Tg
- Application method
- Dam, Adhesive Glass sealing CMOS Image sensor Sensor
| Item | SD-305-C23 |
| Viscosity | 10 Pa・s |
| Thixotropic Index (TI) | > 5.0 |
| Tg | 200℃ |
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