SD-213 Die attach material
- Field
- Semiconductor materials CIS related material Semiconductor materials
- Characteristic performance
- Bleedless One component Epoxy resin Low stress Low warpage High adhesion
- Application method
- Fixing Adhesive Die attachment Dibond CMOS Image sensor Chip components adhesive Sensor
| Item | SD-213 |
| Viscosity | 10 Pa・s |
| Thixotropic Index (TI) | 5.0 |
| Tg |
ー26℃ |
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