EF-328 Encapsulant for semiconductor package
- Field
- Semiconductor materials Liquid encapsulant Underfill material Semiconductor materials Liquid mold underfill material
- Characteristic performance
- One component Flexibile Low modulus Epoxy resin Low stress
- Application method
- Battery/Cell peripheral parts Encapsulant Module Sensor Dispense
| Item |
EF-328 |
| Viscosity | 50 Pa・s |
| Tg | ー20℃ |
| Modulus |
130 MPa (23℃) |
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