EF-300T Mold underfill
- Field
- Semiconductor materials Liquid encapsulant Underfill material Semiconductor materials Liquid mold underfill material
- Characteristic performance
- Low CTE One component Flexibile Low modulus Epoxy resin Low stress High adhesion
- Application method
- MUF (Mold Underfill) 5G/ Communication related Encapsulant Module Sensor
| Item | EF-300T |
|
Viscosity |
120 Pa・s |
| Coefficient of thermal expansion (CTE) |
18 ppm/℃ |
| Tg | 60℃ |
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