Semiconductor and LED materials
Engaged in the development and manufacture of products such as resins with superior hardness, heat resistance, and humidity resistance for liquid encapsulation of semiconductors, various underfill materials, and ultra-low stress encapsulation resins. In addition, to each method of construction, we customize materials with superior work characteristics. In the field needing a void free formation, we suggest in particular vacuum printing, a method of construction of the pressurization hardening.
We develop the most suitable resin in accord with customer request for LED lamp, the LED package for PLCC, lens formation materials, the die attach material for LED. We develop the epoxy and silicone resin products which meet wide needs.
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