Development and manufacture of a range of products including reliable semiconductor liquid sealants with superior heat resistance and humidity resistance, ultra-low stress sealants, and various underfill materials.
We are also able to customize materials with superior workability to suit each method of manufacture. Particularly in the field of voidless materials, we are able to provide vacuum printing and pressure curing methods.
Development of custom resins optimized for requirements, for example sealant materials for LED lamps and PLCC LED packages, lens-forming materials, and LED die mounting materials.
Development of epoxy and silicon resin products in response to a wide range of requirements.
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