| Category |
Product Name |
Resin Type / Main Component |
Applications / Uses |
Key Features |
| Resins for Water Treatment Filters |
SA-8358 |
Urethane |
Hollow-Fiber Membrane Potting / MBR |
General Purpose |
| Resins for Water Treatment Filters |
SA-7636 |
Urethane |
Hollow-Fiber Membrane Potting |
Low Extractables / Fast Curing |
| Resins for Water Treatment Filters |
SA-8100 |
Urethane |
Hollow-Fiber Membrane Potting |
Low Viscosity / Low Hardness |
| Resins for Water Treatment Filters |
SA-7591A/SA-8169B |
Urethane |
Hollow-Fiber Membrane Potting / MBR |
High Hardness / High Tg |
| Resins for Water Treatment Filters |
SA-8324 |
Urethane |
Spiral-Wound Membrane Wrapping |
Thixotropic / NSF Certified |
| Resins for Water Treatment Filters |
SA-8342 |
Epoxy |
Hollow-Fiber Membrane Potting / MBR |
General Purpose / Long Pot Life |
| Resins for Water Treatment Filters |
SA-7894 |
Epoxy |
Hollow-Fiber Membrane Potting / MBR |
Low Chlorine |
| Resins for Water Treatment Filters |
SA-8467 |
Epoxy |
Spiral-Wound Membrane Wrapping |
Thixotropic |
| Resins for Water Treatment Filters |
SA-8194 |
Epoxy |
Spiral Membrane Outer Casing |
High Hardness / NSF Certified |
| Resins for Air Filters |
U-830A/B |
Urethane |
Adhesive for Air-Filter Sealing |
Low Outgassing / Fast Curing |
| Resins for Air Filters |
U-840A/B |
Urethane |
Adhesive for Air-Filter Sealing |
Fast Curing |
| Resins for Air Filters |
U-906A/907B |
Urethane |
Adhesive for Air-Filter Sealing |
Flexibility / Sealing Performance |
| Resins for Oil Filters |
A-500A/B |
Epoxy |
Various Oil and Water Filters |
Excellent Oil Resistance, Water Resistance, and Mechanical Properties |
| Resins for Oil Filters |
A-501A/B |
Epoxy |
Various Oil and Water Filters |
Excellent Adhesion to Steel Sheet |
| Resins for Bag Filters |
SA-8393A/B |
Urethane |
Bag Filters |
Low Outgassing / Low Viscosity / Flexible |
| Resins for Bag Filters |
SA-7073A/SA-8415B |
Urethane |
Bag Filters |
Low Outgassing / Conformability |
| Industrial Adhesives |
SR-10/H-50 |
Epoxy |
General Purpose (Most Materials) |
Room-Temperature Curing / Chemical Resistance / High Strength |
| Industrial Adhesives |
SR Bond 173A/B |
Epoxy |
Metal (Aluminum) Bonding |
Heat Resistant / Rapid Heat Curing |
| Industrial Adhesives |
SR Bond 170A/B |
Epoxy |
Aluminum-to-Wood Bonding |
Long Pot Life / Good Workability |
| Industrial Adhesives |
A-663A/BK |
Epoxy |
Chemical-Resistant Applications |
Room-Temperature Curing / Acid Resistance |
| Industrial Adhesives |
SR-10/H-112 |
Epoxy |
Grinding Wheels |
Grinding-Wheel Bonding |
| Industrial Adhesives |
Sanyu Bond SR-600 |
Epoxy |
Binder Applications |
Low Viscosity / Heat Resistance / High Strength |
| Industrial Adhesives |
SA-7073A/B |
Urethane |
Kitchen Sinks |
Dissimilar-Material Bonding / Thermal-Cycle Durability |
| Industrial Adhesives |
SR Bond 171 |
Epoxy |
Metal Panels |
Steel and Stainless-Steel Bonding / Water Resistance |
| Industrial Adhesives |
SA-7896 |
Epoxy |
Metal Panels |
High Bond Strength |
| Industrial Adhesives |
SR Bond 180A/B |
Urethane |
Honeycomb Panels |
Aluminum Bonding / High Durability |
| Industrial Adhesives |
SA-8372A/B |
Epoxy |
Resin Tables / Art |
Excellent Transparency |
| Industrial Adhesives |
SA-8231A/B |
Epoxy |
Resin Tables / Art |
Excellent Transparency |
| Epoxy Resin Curing Agents - SR Cure |
SR Cure H3 |
Latent Curing Agent |
Epoxy Resin Curing Agent |
Latent |
| Epoxy Resin Curing Agents - SR Cure |
SR Cure T |
Amine Curing Agent |
Epoxy Resin Curing Agent |
Fast Curing |
| Epoxy Resin Curing Agents - SR Cure |
SR Cure U |
Amine Curing Agent |
Epoxy Resin Curing Agent |
Fast Curing |
| Special Flexible Sealant |
Kukuri Sealer® |
Polyurea Resin |
Civil Engineering / Construction Sealing |
Ultra-Flexible (775% Elongation) / Weather Resistant / Low-Temperature Curing |
| Special Flexible Sealant |
L-216 |
Polyurea (Primer) |
Primer for Kukuri Sealer |
Strong Substrate Adhesion |
| Adhesives for PP |
SA-8373 (Development Product) |
Urethane |
Bonding PP and Various Plastics |
No Pretreatment Required / Long Pot Life |
| Adhesives for PP |
SA-8448 (Development Product) |
Acrylate |
Bonding PP and Various Plastics |
No Pretreatment / Fast Curing / No Heating Required |
| Void-Reducing Sheet |
PGS-11 |
Epoxy (Sheet) |
Prepreg Surface Layer / Void Reduction |
Reduces Voids and Pinholes |
| Epoxy Resin Sheet for Substrate Impregnation |
DRS-028 |
Epoxy (Sheet) |
Converting Various Substrates into Prepreg |
Small-Batch Prepreg Production / Easy Resin-Content Control |
| Resin Varnish for Substrate Impregnation |
DR-040A/B |
Epoxy (Liquid) |
Fiber-Substrate Impregnation / Prepreg Production |
Forms Prepreg by Drying after Impregnation |
| Thermosetting Adhesive Resin Sheet |
YYS-10 |
Epoxy (Sheet) |
High-Strength Bonding |
High Peel Strength / Shorter Process |
| Thermosetting Adhesive Resin Sheet |
FH-100 |
Epoxy (Sheet) |
High-Strength Bonding (Nonwoven Impregnation) |
Fillet Formation |
| Thermosetting Adhesive Resin Sheet |
YYS-20 |
Epoxy (Sheet) |
High-Heat-Resistance Bonding |
High Heat Resistance |
| Foaming Epoxy Adhesive Sheet |
HPS-28K |
Epoxy (Sheet) |
Composite Weight Reduction / Gap Filling |
High Expansion Ratio |
| Foaming Epoxy Adhesive Sheet |
HPS-102 |
Epoxy (Sheet) |
Composite Weight Reduction / Gap Filling |
Long Shelf Life |
| Foaming Epoxy Adhesive Sheet |
HP-109 |
Epoxy (Liquid) |
Composite Weight Reduction / Gap Filling |
Low-Temperature Foaming (Liquid) |
| Polyurethane Foam |
SRF-4010 |
Polyurethane |
Gaskets / Sealing |
Thixotropic |
| Polyurethane Foam |
SRF-4011 |
Polyurethane |
Fire-Spread Prevention / Sealing |
Flame Retardancy Equivalent to V-0 (10 mm) |
| Polyurethane Foam |
SRF-4012 |
Polyurethane |
Fire-Spread Prevention / Sealing |
Flame Retardancy Equivalent to V-0 (5 mm) |
| Polyurethane Foam |
SRF-4003 |
Polyurethane |
EV Battery Packs, etc. |
High Moisture Resistance |
| Polyurethane Foam |
SRF-4004 |
Polyurethane |
EV Battery Packs, etc. |
High Moisture Resistance |
| Polyurethane Foam |
U-2070 |
Polyurethane |
Thermal Insulation / Cushioning |
Rigid |
| Reactive Hot-Melt Adhesive |
SHM-1001 |
Reactive Hot-Melt Adhesive |
Coating |
Low Viscosity / High Electrical Insulation |
| Reactive Hot-Melt Adhesive |
SHM-1007 |
Reactive Hot-Melt Adhesive |
Coating |
Long Open Time |
| Reactive Hot-Melt Adhesive |
SHM-1008 |
Reactive Hot-Melt Adhesive |
Coating |
Low Viscosity / High Electrical Insulation |
| Reactive Hot-Melt Adhesive |
SHM-2001 |
Reactive Hot-Melt Adhesive |
Bonding |
Low Viscosity / Long Open Time |
| Reactive Hot-Melt Adhesive |
SHM-2002 |
Reactive Hot-Melt Adhesive |
Bonding |
Long Open Time |
| Reactive Hot-Melt Adhesive |
SHM-3002 |
Reactive Hot-Melt Adhesive |
Molding |
High Strength / High Electrical Insulation |
| Reactive Hot-Melt Adhesive |
SHM-3003 |
Reactive Hot-Melt Adhesive |
Molding |
Short Open Time |
| Urethane Resin |
UE-909A/B |
Urethane Resin |
Automotive Components and Other Applications |
Low Modulus |
| Urethane Resin |
SU-2180A/B |
Urethane Resin |
Automotive Components and Other Applications |
Low Stress |
| Urethane Resin |
SU-2130A/B |
Urethane Resin |
Automotive Components and Other Applications |
Low Corrosiveness |
| Urethane Resin |
UF-110-1A/B |
Urethane Resin |
Automotive Components and Other Applications |
High Adhesion |
| Urethane Resin |
SU-3001A/B |
Urethane Resin |
Automotive Components and Other Applications |
Low Modulus / Heat Resistant to 150°C |
| Semiconductor Encapsulant (Molded Underfill) |
EF-300T |
Epoxy |
Modules |
Standard Grade / Low Viscosity / Low Cost |
| Semiconductor Encapsulant (Molded Underfill) |
EF-300TMF2 |
Epoxy |
Modules (Ceramic) |
High Reliability / Low CTE / Low Warpage |
| Semiconductor Encapsulant (Die Attach) |
SD-213 |
Epoxy |
CMOS |
Low Warpage / Low Viscosity / High Reliability |
| Semiconductor Encapsulant (Die Attach) |
SD-303 |
Epoxy |
BGA |
High Reliability / Bleed-Free / Void-Free |
| Semiconductor Encapsulant (Resin Sheet) |
WA-510 |
Epoxy (Sheet) |
MEMS / SAW Filters |
Standard Grade / Cavity Encapsulation |
| Semiconductor Encapsulant (Resin Sheet) |
WA-740 |
Epoxy (Sheet) |
MEMS / SAW Filters |
High Reliability / Cavity Encapsulation |
| Semiconductor Encapsulant (Flexible Resin) |
EF-288-T5 |
Epoxy |
Batteries, Sensors, etc. |
Low Viscosity / Low Modulus |
| Semiconductor Encapsulant (Flexible Resin) |
EF-328 |
Epoxy |
Batteries, Sensors, etc. |
MSL Resistance |
| UV Adhesive for Advanced Packaging (CPO) |
CPO-1 |
UV-Curable Resin |
Co-Packaged Optics |
High Transmittance / PFAS-Free |
| UV Adhesive for Advanced Packaging (CPO) |
CPO-2 |
UV-Curable Resin |
Co-Packaged Optics |
High Transmittance / High Heat Resistance after Reflow |
| Low-Dk/Df Encapsulant |
HEA-4-56 |
Epoxy |
5G / B5G / 6G Packages |
Low Dielectric Properties / Suitable for Compression Molding |
| High-Heat-Resistance Epoxy Resin |
GRS-300 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
Low Viscosity / Long Shelf Life / Tg 260°C |
| High-Heat-Resistance Epoxy Resin |
GRS-320 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
Low Viscosity / High Adhesion / Tg 300°C |
| High-Heat-Resistance Epoxy Resin |
GRS-370 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
Low CTE / Thermally Conductive / Tg 260°C |
| High-Heat-Resistance Epoxy Resin |
RO-8509 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
Low CTE / Thermally Conductive / Tg 260°C |
| High-Heat-Resistance Epoxy Resin |
RO-8512 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
Ultra-High Heat Resistance / Tg 350°C |
| High-Heat-Resistance Epoxy Resin |
RO-8707 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
Long-Term Heat Resistance (No Change after 1,000 h at 250°C) |
| High-Heat-Resistance Epoxy Resin |
RO-8696 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
High Adhesion / Thixotropic / Tg 300°C |
| High-Heat-Resistance Epoxy Resin |
RO-8697 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
High Adhesion / Sag Resistant / Low Modulus / Tg 285°C |
| High-Heat-Resistance Epoxy Resin |
RO-8698 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
High Viscosity / Low CTE / Tg 285°C |
| High-Heat-Resistance Epoxy Resin |
RO-8699 |
Epoxy (One-Part) |
High-Heat-Generating Components / High-Temperature Environments |
High Thermal Conductivity / Low CTE / Tg 260°C |
| High-Thermal-Conductivity Epoxy Resin |
RO-8821 |
Epoxy (One-Part) |
Heat Dissipation, etc. |
High Thermal Conductivity / 8.5 W/m·K |
| High-Thermal-Conductivity Epoxy Resin |
RO-9210 |
Epoxy (One-Part) |
Heat Dissipation, etc. |
High Adhesion |
| High-Thermal-Conductivity Epoxy Resin |
RO-9256 |
Epoxy (One-Part) |
Heat Dissipation, etc. |
Low-Temperature Curing |
| High-Thermal-Conductivity Epoxy Resin |
RO-9214 |
Epoxy (One-Part) |
Heat Dissipation, etc. |
High Heat Resistance / Low Viscosity / Storage Stability / Tg 260°C |
| High-Thermal-Conductivity Epoxy Resin |
RC-8725/RH-8726 |
Epoxy (Two-Part) |
Heat Dissipation, etc. |
Two-Part Room-Temperature Cure / High Thermal Conductivity / 12 W/m·K |
