Home Business/products Semiconductor materials Category 1液エポキシ樹脂 接着剤 シート樹脂、樹脂シート、フィルム Characteristic and Function Low viscosity and high fluidity 高Tg 低Tg Low linear expansion and low CTE High heat resistance High heat resistance High bonding 高信頼性 Low warpage 低硬化収縮 Low temperature curing Use Sealant MUF (mold underfill) PLP and WLP 5G, 6G Mobile High frequency device Sensors Modules Back Electronics/digital components Semiconductor materials Construction/civil engineering materials Materials for industrial adhesives/composite materials Service/Support List of offices Introducing Sanyu Rec's offices around the country Overseas bases Let us introduce Sanyu Rec's overseas bases. Quality/Environmental policy Introducing Sanyu Rec's Quality and Environmental Policy