| EF-300T Mold underfill |
Liquid encapsulantLiquid mold underfill materialSemiconductor materialsUnderfill material |
Epoxy resinFlexibileHigh adhesionLow CTELow modulusLow stressOne component |
EncapsulantMUF (Mold Underfill) 5G/ Communication relatedModuleSensor |
|
| EF-364S3 Encapsulant for semiconductor package |
Liquid encapsulantLiquid mold underfill materialSemiconductor materialsUnderfill material |
|
5G/ Communication relatedEncapsulantModuleSensor |
|
| EF-328 Encapsulant for semiconductor package |
Liquid encapsulantLiquid mold underfill materialSemiconductor materialsUnderfill material |
Epoxy resinFlexibileLow modulusLow stressOne component |
Battery/Cell peripheral partsDispenseEncapsulantModuleSensor |
|
| SD-213 Die attach material |
CIS related materialSemiconductor materials |
BleedlessEpoxy resinHigh adhesionLow stressLow warpageOne component |
AdhesiveCMOS Image sensorChip components adhesiveDibondDie attachmentFixingSensor |
|
| SD-305-C23 Glass sealing material |
CIS related materialSemiconductor materials |
BleedlessEpoxy resinHigh TgHigh ThixotrolyHigh heat resistanceHigh moisture resistanceOne component |
CMOS Image sensorDam, AdhesiveGlass sealingSensor |
|
| EF-413 Encapsulant |
Encapsulant for CIS relatedLiquid encapsulantLiquid mold underfill materialSemiconductor materials |
Epoxy resinHigh adhesionHigh moisture resistanceLow CTE |
Automodtive applicationsDispenseEncapsulant for CMOS Image sensorSensor |
|
| EF-364S3 Encapsulant for semiconductor package |
Liquid encapsulantLiquid mold underfill materialSemiconductor materialsUnderfill material |
|
5G/ Communication relatedEncapsulantModuleSensor |
|
| NPR-770H4S |
Liquid encapsulantLiquid mold underfill materialSemiconductor materials |
Epoxy resinHigh TgHigh adhesionHigh dissipationHigh heat resistanceHigh thermal conductivityOne component |
Battery/Cell peripheral partsEncapsulantModuleSensor |
|
| EF-291 Underfill |
Semiconductor materialsUnderfill material |
Epoxy resinHigh filling propertyLow viscosityOne componentRapid curing |
Adhesive/ FixingBGA / CSPChip components adhesiveDispensingModuleSensorUnderfill |
|
| EZ-421-B5 Underfill |
Semiconductor materialsUnderfill material |
Epoxy resinHigh filling propertyLow viscosityOne componentRapid curing |
Adhesive/ FixingBGA / CSPChip components adhesiveDispensingModuleSensorUnderfill |
|
| EZ-420-6 Underfill |
Semiconductor materialsUnderfill material |
Epoxy resinHigh filling propertyLow CTELow stressLow viscosityOne componentRapid curing |
Adhesive/ FixingBGA / CSPChip components adhesiveDispensingModuleSensorUnderfill |
|
| EA-436-A13 Encapsulant for semiconductor package |
Liquid encapsulantLiquid mold underfill materialSemiconductor materialsUnderfill material |
Epoxy resinHigh TgHigh adhesionHigh heat resistanceHigh moisture resistanceLow CTELow warpageOne component |
EncapsulantMUF (Mold Underfill) 5G/ Communication relatedModuleSensor |
|
| SLS-335 |
Semiconductor materialsSheet material |
Epoxy resinHollow shape encapsulantLow stressSheet resin |
MEMSSaw filter |
|
| SLW-332 |
Semiconductor materials |
Epoxy resinHigh TgHigh heat resistanceLow temperature curingLow warpageSheet resin |
Communication relatedEncapsulation MUF (Mold Underfill) PLPWLP 5G |
|
